Tuesday 19 January 2016

Samsung starts mass production of 4GB HBM2 memory stacks


Samsung today announced it has started mass producing the industry’s first 4 gigabyte (GB) DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface. The new HBM2 DRAM package will be used in upcoming high performance computing (HPC), advanced graphics, network systems, as well as enterprise servers. Both AMD and NVIDIA are rumored to...Read More
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